PURE COPPER LIQUID COOLING MODULE

Three Core Capabilities at a Glance

1. Thermal Simulation & Analysis  

An in-house simulation workflow built on open-source tools (Gmsh meshing + FEM heat-transfer solver + ParaView post-processing) is used to generate temperature contour maps and evaluate thermal resistance. Simulation models are calibrated against experimental data to establish a closed-loop simulation–validation workflow.  

2. Lattice / Microchannel Design  

Lattice structures (strut-based / TPMS) are generated during the design and slicing process in accordance with DfAM principles, including self-supporting channel geometries, powder evacuation, and minimum wall-thickness control, enabling print-ready design output.  

3. Pure Copper Additive Manufacturing  

A dedicated LPBF process for pure copper enables one-piece fabrication of micro-fins, internal flow channels, and coolant ports. Prototype parts featuring 0.2 mm-thick × 4.69 mm-high micro-fins have been successfully fabricated.

A. Thermal Simulation & Analysis Capability

An in-house simulation toolchain built on open-source technologies for evaluating temperature fields and thermal resistance in liquid-cooling modules.

1. Scope of Analysis

Steady-state and transient heat-transfer analysis for cold plates and heat-sink fins, providing temperature contour maps, hot-spot identification, and overall thermal-resistance evaluation.

2. Boundary Condition Methodology

The channel-side heat transfer coefficient (HTC) is calculated using engineering correlations based on flow rate and channel geometry, while accounting for coolant temperature rise along the flow path. Pressure drop is also estimated using established engineering correlations.

3. Closed-Loop Simulation & Validation

Measured flow-rate–pressure-drop data and coolant inlet/outlet temperatures from in-house prototypes are fed back into the simulation model for calibration.

Simulation accuracy is progressively refined through iterative prototyping, testing, and model validation.

A-1. HTT-CALC Rapid Thermal-Resistance Estimation Tool

Developed In-House

Enter geometric parameters and cooling conditions to obtain thermal resistance stack up, pressure drop, and temperature predictions within seconds, enabling rapid design iteration as early as the quotation stage.

A-2. Calculation Method: Series Thermal-Resistance Network

All equations are based on widely accepted engineering correlations from published literature.

The methodology document, HTT-TN-2026-CP01, is available for review by your thermal design team.

B. Lattice / Microchannel Design Capability

Design for Additive Manufacturing (DfAM)

C. Pure Copper Additive Manufacturing

Prototype Results

D. Pure Copper Micro-Fin Prototype Showcase

E. Surface Roughness Measurement & Verification

After Magnetic Finishing

HTT-Cu140 

Dedicated Copper LPBF System

Copper Powder Supply Chain & Material Partners

Premium Japanese Metal Powder × Single-Point Supply Coordination

Flexible Supply from Small-Batch Prototyping to Mass Production

Supply Framework:
All metal powder supply is coordinated through a single point of contact, Daido Kogyo Co., Ltd. (DKK), a core trading company of the Daido Steel Group.

The supply portfolio includes gas-atomized spherical powders with low oxygen content, high purity, and excellent flowability. Particle-size distributions can be tailored to equipment requirements, providing flexible supply from small-batch prototyping through full-scale production.

F. AI-Assisted Cold Plate Analysis System